十層三階HDI板

Release time：2019-08-28 Editor author：Jin Zhi Zhu Read：30335

層數： 10L

板厚： 1.2mm

特殊要求：樹脂塞孔

表面處理：沉金

材料：FR-4 TG170

外層線寬/線距: 2.95/2.95mil

內層線寬/線距: 2.36/2.36mil

最小孔徑：盲孔0.1mm，埋孔0.2mm，通孔0.2mm

銅厚：外層1oz，內層0.5oz & 1oz

十層三階HDI板-1.jpg

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